My ASEMEP Technical Papers

ASEMEP_Award_2015_b

I just want to have this page as repository for my technical papers presented at the annual ASEMEP  National Technical Symposium (Association of Semiconductor and Electronics Manufacturing Engineers of the Philippines).

  • “QFN Fine Pitch Packaging Design and Manufacturing Challenges”, 22nd ASEMEP National Technical Symposium, June 7-8, 2012 (Awarded Overall Best Paper)

ASEMEP – QFN Fine Pitch Packaging Design and Manufacturing Challenges

  • “Understanding the Mechanical Behavior of Thin Packages During Die Attach Curing Process,” 25th ASEMEP National Technical Symposium, June 4-5, 2015 (R&D Special Award)

Understanding the Mechanical Behavior of Thin Packages During Die Attach Curing Process

  • “Burn-in Oven Modeling Using Computational Fluid Dynamics (CFD)”, 13th ASEMEP National Technical Symposium, June 19-20, 2003

ASEMEP Paper – Burn-in Modeling

  • “Understanding Silicon Die Fracture Strength Using Weibull Analysis”, 14th ASEMEP (Association of Semiconductor & Electronics Manufacturing Engineers of the Philippines) National Technical Symposium, June 17-18, 2004

ASEMEP_Weibul_Die_Crack

  • “Using Finite Element Analysis in Understanding Package Moisture Absorption Behavior”, 22nd ASEMEP National Technical Symposium, June 7-8, 2012

ASEMEP – Using Finite Element Analysis in Understanding Package Moisture Absorption Behavior

  • “Understanding and Eliminating Wire Bondability Problem on Overhang Stacked Die,” 23rd ASEMEP National Technical Symposium, June 2013

Understanding and Eliminating Wire Bondability Problem on Overhang Stacked Die R1 (2)

  • “Elimination of Delamination and Solder Flow-out in a New SiP with Large SMD,” 23rd ASEMEP National Technical Symposium, June 2013

Elimination of Delamination and Solder Flow-out in a New SiP with Large SMD R1

  • “Optimization of Stacked Die QFN Package Reliability Through Design and Virtual Prototyping,” 23rd ASEMEP National Technical Symposium, June 2013

Optimization of Stacked Die QFN Package Reliability Through Design and Virtual Prototyping

  • “The Effect of Glue Bond Line Thickness and Fillet Height on Interface Delamination,” 23rd ASEMEP National Technical Symposium, June 2013

The Effect of Glue Bond Line Thickness and Fillet Height on Interface Delaminationx

 

Other ASEMEP papers supported:

A Systematic Approach in Optimizing Strip Warpage of Quad Flat No-lead Package Rev 1

ELIMINATION OF VOIDS AND DELAMINATION BY OPTIMIZING SUBSTRATE DESIGN

Citation (IEEE Reference [6]):

01638762_Die_Fracture

 

 

Paper Awards:

Category_Best_Paper2012

Overall_Best_Paper2012

ASEMEP_RnD_Award 2015

Category Best Paper 2017